ESD: Introduction

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Did you know that you can destroy an IC by merely touching it? If you find this fact strange and unbelievable, you probably have not heard of ESD. Perhaps, you already destroyed dozens of expensive ICs without realizing it, unfairly blaming the IC manufacturer and the vendor for the bad part.

ElectroStatic Discharge

ESD

   

      Terror in Silicon Land

I heard lot of engineers saying the Electrostatic Discharge ESD threat in the Phillippines does not exist, thanks to our hot and humid climate. Hearing it too often, I too, for a while, fell for this nonsense.  It turned out to be one of the most costly blunders in my career. Being that gullible gave me countless wasted hours debugging and redesigning prototypes that inexplicably fails during testing. I chased this problem through the manufacturing phase, where we can’t seem to get yields better than 85% from any production line. Lots of bad ICs go to the thrash. I kept looking for explanation for these defects, the absence of which fostered me some suspicion to the IC manufacturer. It took me years (and millions of my employer money) before I became wiser to realize that all this woes were caused in large part by ESD. After implementing a modest ESD control program in our factory, IC defects practically disappeared.

Today, I can see the same misguided wisdom plaguing the life of most electronic techies, not only of students and experimenters, but also of experienced engineers who are supposed to know better. Proven circuit designs refuses to work, component busted as fast as it is replaced, circuit board doing wicked and weird things, etc, all of these may have been caused by an essentially simple and easy to avoid phenomenon, ESD. This article aims to increase your awareness about the problem, and introduce to you simple but effective solutions to get rid of the ESD problem.

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03/24/2007

Last Update

 

Rev A

Initial Release

 

Written By:

 

Henry L. Chua

comments?

hlc@e-gizmo.com

 

Copyright 2004-2007, by e-Gizmo mechatronix and the author. No part of this publication may be reproduced elsewhere without the author's permission. 

 

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