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Learning the Basics
Static electricity is electric charge at rest. As long
as it stays resting, it will not cause harm to anything or anyone. The
static charge builds up in nature rather slowly. The trouble starts when the
charge becomes too much, it will seek some way to unload the charge. When a
discharge happens, it will be quick, violent, and destructive. This event is
what we call as the Electrostatic Discharge, or ESD. A good example of ESD
event occurring in majestic scale is lightning.
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Static Electricity is generated and transferred
to our body in various ways. Even mundane task like walking across a
polished floor may generate kilovolts of static charge in our body,
enough to zap an IC to its untimely death when a sudden discharge occur
as you touch it. This event may be too weak for us to even feel and
notice it, but is too much and devastating for an IC. To better
understand the threat, it may help if we take a look on
some
basics of static electricity generation. |
There are several ways static electricity is generated,
but triboelectric charging provides the most efficient means, and expectedly
is the most common and troublesome.
| Triboelectric charging occurs when two
materials are rubbed or separated from each other. Note that this
condition essentially happens every time something move! We and the object we come in contact with
collect static charge whenever we walk (your shoe
separating from the floor), get off our seat, comb our hair, grab a
bottled drink, to name a few. Table 1 illustrates the amount of static
we can produce
while
doing some common tasks. The amount of charge generated depends
on the kind materials, environmental conditions, and how fast the
separation occurs. Generally speaking, insulating materials, such as
plastics, generates static electricity several magnitudes more compared
to conducting materials. A good illustrative example is a plastic
(‘scotch’) tape. Notice how dirt comes rushing toward the plastic tape
whenever you pull a portion from the roll. This attraction is caused by,
you guessed it, the static
charge generated over the separation. Even the piece of
paper you are taping over will impatiently lift itself toward the tape
as it hover, making the landing a little off the desired
mark.
Semiconductor Devices ESD susceptibility
Today’s advances in semiconductor technology
enables the chip maker to shrink electronics circuit to sub micron
scale, allowing them to produce silicon chips containing a mind boggling
hundred of millions of transistors on a thin silicon slab smaller than
a 25 centavo coin. This scale of miniaturization also results in chips
that runs faster, consumes less power, and topping that, costs less.
But as space between components shrink, it becomes
easier for voltage potential to puncture the ever thinning insulation
and cross the gap between them, starting the chain of events leading to
the destruction of the device. In other words, as things get smaller,
the risk of ESD damage proportionately increases. Table 3 shows the
comparative listing of technologies available over the indicated years,
and the maximum amount of voltage allowable between the embedded
components.
Table 3. |
|
Table 1
Examples of Static Generation
Typical Voltage Levels
|
|
Means of Generation
|
10-25% RH
|
65-90% RH
|
|
Walking across carpet |
35,000V |
1,500V |
|
Walking across vinyl tile |
12,000V |
250V |
|
Worker at bench |
6,000V |
100V |
|
Poly bag picked up from bench |
20,000V |
1,200V |
|
Chair with urethane foam |
18,000V |
1,500V |
Source: www.esda.org
Table 2
Triboelectric series
|

|
Rabbit
fur
Glass
Mica
Human
Hair
Nylon
Wool
Fur
Lead
Silk
Aluminum
Paper
COTTON
Steel
Wood
Amber
Sealing
Wax
Nickel,
Copper Brass, Silver
Gold,
platinum
Sulfur
Acetate
rayon
Polyester
Celluloid
Silicon
Teflon
|
|
|
Technology Trends
|
|
Year
|
1995 |
1998 |
2001 |
2004 |
2007 |
|
Feature
size (mm) |
0.35 |
0.25 |
0.18 |
0.12 |
0.10 |
|
Voltage
(V) |
3.5 |
2 - 3.5 |
1.50 – 1.9 |
1.0 – 1.5 |
1.0 |
Source: Terry
Welsher, Bell Labs, Lucent Technologies, 12/2/97 [5]
|
IC ESD protection provides only limited protection. Most semiconductor devices are manufactured with some
level of ESD protection built-in. Although this significantly reduces the
risk of damage, it still does not provide total protection. Table 4 list the
susceptibility level of some common semiconductor devices. At this point, we
can illustrate the threat by first looking back at Table 1. Let us pick a
very common situation - a worker seated on a urethane foam chair. Even in
humid environment, the worker can collect static charge up to 1,500V. If
this worker is working on electronic components, we can see from Table 4
that not a single
component is safe!
|
Table 4. Device Susceptibility
|
Device Type |
VOLTS |
|
VMOS |
20-1800 |
|
MOSFET |
100-200 |
|
GaAsFET |
100-300 |
|
EPROM |
100 |
|
JFET |
140-7000 |
|
SAW |
150-500 |
|
OPAMP |
190-2500 |
|
CMOS |
250-3000 |
|
SCHOTTKY DIODE |
300-2500 |
|
FILM RESISTORS |
300-3000 |
|
BIPOLAR TRANSISTOR |
380-7000 |
|
ECL |
500-1500 |
|
SCR |
680-1000 |
|
SCHOTTKY TTL |
1000-2500 |
|
ESD DAMAGE
A semiconductor devices subjected to electrical
overstress, or zapped by ESD, can be damaged in two ways - by catastrophic
failure or latent damage.
 |
Catastrophic failure immediately shows itself as an
inoperative part hence is quite easy to spot. Device with latent damage, on
the other hand, are difficult to detect, because even with the defect, the
device seems to work properly. This is not a cause for celebration, however,
as this defect is substantially worse than catastrophic failure. A device
with latent defect is a diseased part waiting for a spectacular moment to
say its final goodbye. This moment will come sooner than you think, and as
Murphy would have it, it will happen at the worst possible time and place. |
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03/24/2007
Last
Update
Page 2 of 5 pages
Rev A Initial
Release Written By:
Henry L. Chua
comments?
hlc@e-gizmo.com
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